PolarHV TM HiPerFET
Power MOSFET
(Electrically Isolated Back Surface)
N-Channel Enhancement Mode
IXFR 36N60P
V DSS
I D25
R DS(on)
t rr
=
=
600
20
200
200
V
A
m ?
ns
Avalanche Rated
Fast Intrinsic Diode
Symbol
Test Conditions
Maximum Ratings
ISOPLUS247 (IXFR)
V DSS
V DGR
T J = 25 ° C to 150 ° C
T J = 25 ° C to 150 ° C; R GS = 1 M ?
600
600
V
V
E153432
V GSS
V GSM
Continuous
Transient
± 30
± 40
V
V
G
D
S
Isolated Tab
I D25
T C = 25 ° C
20
A
I DM
I AR
T C = 25 ° C, pulse width limited by T JM
T C = 25 ° C
80
36
A
A
G = Gate
S = Source
D
= Drain
E AR
E AS
T C = 25 ° C
T C = 25 ° C
50
1.5
mJ
J
Silicon chip on Direct-Copper-Bond
International standard package
Fast recovery diode
Unclamped Inductive Switching (UIS)
dv/dt
P D
T J
T JM
T stg
T L
T SOLD
V ISOL
I S ≤ I DM , di/dt ≤ 100 A/ μ s, V DD ≤ V DSS ,
T J ≤ 150 ° C, R G = 2 ?
T C = 25 ° C
1.6 mm (0.062 in.) from case for 10 s
Plastic body for 10 s
50/60 Hz, RMS, 1 minute
20
208
-55 ... +150
150
-55 ... +150
300
260
2500
V/ns
° C
° C
° C
° C
° C
° C
V~
Features
l
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
l
l
l
rated
F C
Weight
Mounting force
20..120/4.6..27
5
N/lb
g
l
Low package inductance
- easy to drive and to protect
Symbol Test Conditions
Characteristic Values
Advantages
(T J = 25 ° C, unless otherwise specified)
BV DSS V GS = 0 V, I D = 250 μ A
Min. Typ. Max.
600
V
l
l
Easy to mount
Space savings
V GS(th)
V DS = V GS , I D = 4 mA
3.0
5.0
V
l
High power density
I GSS
V GS = ± 30 V, V DS = 0 V
± 100
nA
I DSS
V DS = V DSS
V GS = 0 V
T J = 125 ° C
25
250
μ A
μ A
R DS(on)
V GS = 10 V, I D = I T (note 1)
Pulse test, t ≤ 300 μ s, duty cycle d ≤ 2 %
200
m ?
? 2006 IXYS All rights reserved
DS99395E(03/06)
相关PDF资料
IXFR40N90P MOSFET N-CH ISOPLUS247
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